The Thermal Grizzly Minus Pad Extreme is an excellent choice for applications where thermal paste is not suitable due to its cumbersome application. This is particularly useful when bridging gaps between a heat source and a heatsink, such as with memory chips and voltage regulators. The silicone-based thermal pad has a consistency similar to modeling clay.

This allows for an ideal surface design with maximum possible compression. The thermal conductivity has been improved by approximately 260% compared to the Minus Pad 8, enabling the best performance for challenging cooling processes like voltage regulators and memory ICs.

The Minus Pad Extreme is available in various sizes and thicknesses - here it is 100 x 100 x 1.5 mm. The pads perform excellently even with very low contact pressure, and the thermal conductivity is only slightly affected by thickness. Therefore, the choice of thickness should depend entirely on the gap to be bridged. The Minus Pad Extreme is electrically insulating. Due to its consistency, only a single use is recommended.

Caution! This product comes with a protective film that must be removed before installation. We do not accept liability for damages caused by improper or incorrect installation and misuse!

Technical details:

• Dimensions: 100 x 100 x 1.5 mm
• Quantity: 1
• Density: 3.38 g/cm³
• Hardness: 65 Shore 00
• Dielectric strength: 8 KV/mm ASTM D149
• Operating temperature: -100 to +250 °C
• Flammability: V-0
• Color: Rust brown.