The RS PRO thermal interface pad is a high-performance solution for efficient heat transfer in various applications. With a thermal conductivity of 3 W/m·K, it ensures effective heat dissipation, making it ideal for use in electronic devices and other heat-sensitive applications. The pad has a thickness of 2 mm and is self-adhesive, allowing for easy installation. It is silicone-free, making it a suitable choice for applications where silicone is not desired. The product is designed for operating temperatures ranging from -40 °C to +125 °C, providing a wide range of usage possibilities. The hardness of 45 Shore OO ensures good adaptability to different surfaces, further enhancing the efficiency of heat transfer.

• Silicone-free material for specialized applications
• Self-adhesive for easy handling
• Operating temperature range of -40 °C to +125 °C
• Hardness of 45 Shore OO for optimal adaptability.