The GP-Ultimate 120x120 is designed to provide a perfect thermal interface for transferring heat to heat sinks when installed on circuit boards with height differences and uneven surfaces, such as DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs, and other high-temperature SMD components. With its enhanced multilayer matrix, superior material composition, and ultimate thermal conductivity of 15 W/mK, the GP-Ultimate 120x120 delivers the best performance in its class.

The GP-Ultimate 120x120 is non-electrically conductive, non-corrosive, non-hardening, non-toxic, and supports an extended operating temperature range of -60 °C to 220 °C. It features seamless application and has a thermal pad size of 120 x 120 mm to optimally fit enlarged surfaces of RAM memory modules, GPU and CPU VRM circuits, M.2 SSD types, and other densely packed electronic devices.