Name: DC-HA11TZ/RPW for Intel Socket LGA1700, Low Profile Design (65W)
Brand: Titan
SKU: 32710556
Price: 15.7 EUR
Availability: InStock

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Titan

GlacialTech CPU Cooler: Where Technology Meets Coolness! The DC-150A915Z Series/RPW is a CPU cooler designed for the Intel LGA 1700 platform. Equipped with radial aluminum cooling fins and a quiet fan, this CPU cooler can centralize airflow and effectively improve heat dissipation. Additionally, the cooler's back holder reinforces it to prevent motherboard deformation. Ideal for versatile flat cases. It is an excellent choice for a high-quality computer CPU cooler.

Key Features:
- Recommended Placement: Processor
- Type: Air Cooling
- Fan Diameter: 9.5 cm
- Supported Processor Sockets: LGA 1700
- Rotation Speed (min.): 1000 RPM
- Rotation Speed (max.): 2600 RPM
- Noise Level (low speed): 24.8 dB
- Noise Level (high speed): 33.4 dB
- Minimum Airflow: 18.3 cfm
- Maximum Airflow: 47.6 cfm
- Minimum Air Pressure: 0.99 mmH2O
- Maximum Air Pressure: 3.88 mmH2O
- Mean Time Between Failures (MTBF).

Actual product image Titan DC-HA11TZ/RPW for Intel Socket LGA1700, Low Profile Design (65W) (30 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

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