The RS PRO thermal interface pad is a high-performance solution for efficient heat transfer in various applications. With a thermal conductivity of 1.6 W/m·K, it ensures effective heat dissipation, making it ideal for use in electronic devices and other technical applications. The pad is made from durable fiberglass, which not only provides high thermal efficiency but also offers excellent mechanical stability. With a thickness of 0.25 mm, it is thin enough to be used in tight spaces while maintaining the necessary thermal conductivity. The compact dimensions of 19 x 12.7 mm make it versatile and allow for easy integration into various systems.

• High-quality thermal conductivity of 1.6 W/m·K
• Durable fiberglass material for high stability
• Thin design with only 0.25 mm thickness for flexible applications.