The RS PRO thermal pad is a high-performance solution for efficient heat transfer in various applications. With a thermal conductivity of 3 W/m·K, it ensures effective heat dissipation, making it ideal for use in electronic devices and other technical applications. Made from high-quality polymer resin, this thermal pad offers reliable performance and durability. The self-adhesive backing allows for easy application, while the specific dimensions of 297 x 210 mm and a thickness of 0.2 mm provide flexible adaptation to different requirements. This product is particularly suitable for applications where precise heat dissipation is necessary to maximize the efficiency and lifespan of components.

• Thermal conductivity of 3 W/m·K for efficient heat transfer
• Made from high-quality polymer resin for durability
• Dimensions of 297 x 210 mm and thickness of 0.2 mm for versatile applications.