Name: Xeon W W3-2435 - 3.1 GHz - 8 cores
Brand: Intel
SKU: 31479609
Price: 854.35 EUR
Availability: InStock

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Intel

The Intel Xeon W3-2435 processor is a powerful CPU specifically designed for server applications and demanding workloads. With a clock speed of 3.1 GHz and the ability to reach up to 4.5 GHz in Turbo mode, this processor offers high computing performance. It features 8 cores and supports 16 threads, enabling efficient multitasking. The processor is equipped with a 22.5 MB Smart Cache, further optimizing data processing speed. Support for quad-channel memory and a maximum memory speed of 4400 MHz make it an ideal choice for memory-intensive applications. The Xeon W3-2435 is designed for the LGA 4677 socket and has a thermal design power (TDP) of 165 W, making it an energy-efficient solution for modern server environments. Additionally, it offers advanced security features through Intel® Trusted Execution Technology and virtualization technologies, allowing for secure and isolated execution of applications.

- Maximum memory capacity of 2000 GB
- Support for Hyper-Threading technology
- 7nm lithography for improved energy efficiency
- Compatible with PCI Express version 5
- Integrated Intel technologies such as Software Guard Extensions (SGX).

Actual product image Intel Xeon W W3-2435 - 3.1 GHz - 8 cores (LGA 4677, 3.10 GHz, 8 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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PCI express version (max.)

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Xeon W W3-2435 - 3.1 GHz - 8 cores

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