Name: Xeon W W3-2423 - 2.1 GHz - 6 cores
Brand: Intel
SKU: 31479608
Price: 487.95 EUR
Availability: InStock

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Intel

The Intel Xeon W W3-2423 is a powerful processor designed for demanding applications and workloads. With a base clock frequency of 2.1 GHz and the ability to reach up to 4.2 GHz in Turbo mode, this processor delivers excellent performance for multithreading applications. It features 6 cores and supports 12 threads, allowing for efficient processing of multiple tasks simultaneously. The 15 MB cache memory ensures fast data processing and enhances the overall system performance. The Xeon W W3-2423 is built on modern 10nm manufacturing technology, which provides high energy efficiency and performance. It is ideal for server and workstation applications that require high computing power and reliability. Additionally, the processor supports a variety of Intel technologies that enhance security and virtualization, making it an excellent choice for professional environments.

- Support for up to 2000 GB of RAM in quad-channel mode
- Maximum Thermal Design Power (TDP) of 144 watts
- Compatible with LGA 4677 socket
- Support for Intel Turbo Boost Technology 2.0
- Integrated security features through Intel Trusted Execution Technology.

Actual product image Intel Xeon W W3-2423 - 2.1 GHz - 6 cores (LGA 4677, 2.10 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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PCI express version (max.)

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Xeon W W3-2423 - 2.1 GHz - 6 cores

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