Name: CPU CORE U5-225F S1851 BOX/3.3G BX80768225F S RQD2 IN
Brand: Intel
SKU: 58920037
Price: 168.02 EUR
Availability: InStock

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Intel

The Intel Core U5-225F processor is a powerful and efficient solution for desktop computers. With a base clock frequency of 3.3 GHz and a maximum turbo clock frequency of 4.9 GHz, this processor delivers impressive performance for demanding applications and multitasking. The architecture is based on the latest Arrow Lake technology and supports 64-bit operating systems, allowing for optimal utilization of hardware resources. With 10 cores, the U5-225F is capable of handling multiple tasks simultaneously, making it ideal for creative applications, gaming, and productive work environments. The processor is designed for the LGA1851 socket and has a maximum thermal design power (TDP) of 65 watts, making it an energy-efficient choice for modern desktop systems. The processor comes in a boxed package that provides additional protection.

- 10 processor cores for efficient multitasking
- Maximum turbo clock frequency of 4.9 GHz for high performance
- 64-bit architecture for optimal resource utilization
- Integrated Intel AI Boost for enhanced performance
- Energy-efficient 65-watt TDP for lower power consumption.

Actual product image Intel CPU CORE U5-225F S1851 BOX/3.3G BX80768225F S RQD2 IN (LGA 1851, 3.30 GHz, 10 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

NPU power

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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