Name: Core i9-10900F
Brand: Intel
SKU: 12927647
Price: 514.7 EUR
Availability: InStock
Rating: 4.67 (12 reviews)

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Intel

The Intel Core i9-10900F is a powerful 10th generation processor designed for demanding applications and gaming. With a base clock speed of 2.8 GHz and a maximum turbo frequency of up to 5.2 GHz, this processor delivers impressive performance for multitasking and compute-intensive tasks. It features 10 cores and 20 threads, allowing for efficient processing of multiple tasks simultaneously. The processor is equipped with a 20 MB Smart Cache, which enhances data processing speed and optimizes overall performance. The Intel Core i9-10900F is designed for the LGA1200 socket and supports modern technologies such as Intel Turbo Boost Max Technology 3.0 and Intel Optane Memory, further boosting performance. With a Thermal Design Power (TDP) of 65 watts, this processor is energy-efficient and suitable for both gaming PCs and high-performance workstations.

- 10 cores and 20 threads for efficient multitasking
- Maximum turbo frequency of 5.2 GHz for high performance
- 20 MB Smart Cache to optimize data processing
- Supports Intel Turbo Boost Max Technology 3.0
- Compatible with LGA1200 socket for modern motherboards.

Actual product image Intel Core i9-10900F (LGA 1200, 2.80 GHz, 10 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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