Name: Xeon Ib E3 1230 V2 8M 3.3 Ghz
Brand: HPE
SKU: 18063722
Price: 429 EUR
Availability: InStock

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The HPE CPU Xeon IB E3 1230 V2 is a powerful processor designed for demanding applications and server environments. With a clock speed of 3.3 GHz and the ability to reach up to 3.7 GHz in Turbo mode, this processor delivers high computing performance. It belongs to the Xeon E3 family and is equipped with four processor cores that support a total of eight threads. This enables efficient processing of multiple tasks simultaneously, making it ideal for virtualization applications and server operating systems. The 22-nanometer lithography enhances energy efficiency, while the maximum Thermal Design Power (TDP) of 69 watts allows for optimal cooling. The processor supports dual-channel memory with a maximum capacity of 32 GB DDR3 RAM, further boosting performance in memory-intensive applications.

- Maximum Turbo clock speed of 3.7 GHz for additional performance
- Support for virtualization technologies (VT-d and VT-x)
- Dual-channel memory architecture for improved data transfer
- 8 MB L3 cache to optimize data processing
- High transfer rate of 5 GT/s for fast data communication.

Actual product image HPE Xeon Ib E3 1230 V2 8M 3.3 Ghz (3.30 GHz, 4 -Core)

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Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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