Genesis Silicone thermal compound /m-K
8.30 W/m K, 0.50 g9 items in stock at supplier
Product details
The Genesis Silicon 701 thermal paste is a high-performance thermal grease specifically designed for efficient heat transfer between electronic components. With a thermal conductivity of 8.3 W/m·K, this paste ensures effective heat dissipation, enhancing the performance and lifespan of devices. The paste is gray in color and is offered in a convenient 0.5 g packaging that allows for easy application. It is ideal for use in computers, graphics cards, and other electronic devices where optimal heat dissipation is required. The density of 1.6 g/cm³ ensures even distribution and a reliable connection between surfaces. Please pay attention to the safety and hazard warnings to ensure safe handling.
- Thermal conductivity of 8.3 W/m·K for optimal heat transfer
- Density of 1.6 g/cm³ for even distribution
- Convenient 0.5 g packaging for easy application
- Signal word WARNING with health hazard GHS07.

- H318 Causes serious eye damage.
- H315 Causes skin irritation.
30-day right of return if unopened