The Gelid Solutions HeatPhase Ultra is a high-performance thermal pad specifically designed for efficient heat transfer in electronic devices. With a thermal conductivity of 8.5 W/m·K, it ensures optimal cooling for processors, graphics cards, and other components. Its thin profile of just 0.2 mm allows for easy application without increasing space requirements. The thermal pad has a compact size of 40 mm in width and 30 mm in depth, making it ideal for use in tight spaces. It is an essential accessory for anyone looking to maximize their hardware performance by preventing overheating. The HeatPhase Ultra is available in a pack containing one piece and provides a reliable solution for heat dissipation.

• High thermal conductivity of 8.5 W/m·K
• Thin design with only 0.2 mm thickness
• Ideal for tight installation conditions.