Eight proprietary, custom-designed superconducting heat pipes utilize a groove and powder wick structure with variable thickness for maximum efficiency in heat transfer.

The powerful dual tower design maximizes performance and surface area with optimized fin density and thickness.

The optimized layout, consisting of eight heat pipes, ensures that heat is transferred to all fin areas for efficient dissipation.

The enlarged surface of the nickel-plated copper base ensures seamless contact and complete coverage to address all heat zones. The thickness of the base layer is minimized to allow for faster thermal conductivity and a lower cooling height for improved case compatibility.

Equipped with dual variable Mobius fans for exceptional silence without compromising performance.

Offset 120mm and 135mm Mobius fans create an ultimate push-pull setup for perfect airflow and air pressure to maximize heat dissipation.

The 120mm Mobius fan provides 42mm RAM clearance to accommodate a wider range of builds without sacrificing performance.

The aluminum surface of the Stealth series and the completely black hardware components provide a high-quality and clean design.

Pre-applied high-performance thermal paste.