Name: FX-6100, Bulldozer, 6C/6T
Brand: AMD
SKU: 285354
Rating: 4.2 (5 reviews)

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The FX-6100 is a powerful hexa-core processor optimized for demanding applications and multitasking. With a base clock speed of 3.3 GHz and a maximum turbo clock speed of 3.9 GHz, this processor delivers impressive performance for various computer applications. The FX-6100 features an unlocked multiplier, allowing for easy overclocking and facilitating adjustments to individual performance requirements. The processor's architecture is based on the Zambezi architecture and is manufactured using a 32-nanometer lithography, ensuring efficient energy use. With a total of six cores and six threads, the FX-6100 is capable of handling multiple tasks simultaneously, making it an ideal choice for gaming, content creation, and other compute-intensive applications.

- Maximum turbo clock speed of 3.9 GHz for additional performance
- Six cores and six threads for efficient multitasking
- Unlocked multiplier for easy overclocking
- Integrated support for AMD Virtualization
- Comprehensive compatibility with AM3+ socket.

Actual product image AMD FX-6100, Bulldozer, 6C/6T (AM3+, 3.30 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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