Name: FX-4300, Vishera
Brand: AMD
SKU: 402923
Rating: 4.29 (21 reviews)

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The AMD FX-4300 processor belongs to the FX series from Advanced Micro Devices and is designed for desktop applications. With an advanced 32nm lithography, this processor offers a combination of performance and efficiency. It features four processing cores that reach a clock speed of 3.8 GHz and can even reach up to 4 GHz in Turbo mode. This makes it a suitable choice for users who need solid performance for multitasking and demanding applications. The FX-4300 supports a variety of modern technologies that further enhance performance and efficiency. With a 4 MB L3 cache and a 2 MB L2 cache, it is capable of processing data quickly and optimizing performance. The processor is compatible with the AM3+ socket and has a maximum Thermal Design Power (TDP) of 95 watts, making it an energy-efficient option for desktop systems.

- 4 processing cores with a base clock speed of 3.8 GHz
- Maximum Turbo clock speed of 4 GHz for additional performance
- Supports AMD Virtualization for enhanced virtualization capabilities
- 4 MB L3 cache and 2 MB L2 cache for faster data access
- Compatible with the AM3+ socket for versatile system configurations.

Actual product image AMD FX-4300, Vishera (AM3+, 3.80 GHz, 4 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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