Name: EPYC 4364P - 4.5 GHz - 8 cores - 16
Brand: AMD
SKU: 47717563
Price: 339 EUR
Availability: InStock

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Top performance at top prices

You are surely familiar with the AMD EPYC processor family – a range of server processors that deliver uncompromising performance and capabilities for enterprise applications across a variety of markets and requirements. Together, they represent some of the most compelling options for enterprise customers addressing enterprise, cloud, edge, and HPC needs.

However, even with such a broad and already available range, there are still challenges that the new AMD EPYC processors can address. This is why AMD is now introducing the AMD EPYC 4004 series processors.

Getting Started with Server Infrastructure

The AMD EPYC 4004 series processors extend the established high-efficiency AMD "Zen 4" high-performance core architecture into a new area aimed at customers seeking an expanded offering of entry-level systems. These processors are the ideal solution for growing small to medium-sized businesses, customers of hosted IT services, and anyone looking to expand their own local server infrastructure.

These new optimized single-socket processors focus on three key elements to deliver strong performance for general server workloads: performance, ease of use, and an attractive price.

Actual product image AMD EPYC 4364P - 4.5 GHz - 8 cores - 16 (AM5, 4.50 GHz, 8 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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