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The Athlon X4 740 is a powerful quad-core processor suitable for a variety of applications. With a base clock speed of 3.2 GHz and a maximum turbo clock speed of 3.7 GHz, this processor delivers solid performance for everyday tasks as well as more demanding applications. The Athlon X4 740 is energy-efficient with a TDP of only 65 watts, making it well-suited for systems that require low heat generation. The processor is housed in the FM2 socket and supports a range of AMD technologies that further enhance performance and efficiency. With 4 cores and 4 threads, the Athlon X4 740 is capable of handling multiple tasks simultaneously, making it an excellent choice for multitasking applications.

- Maximum turbo clock speed of 3.7 GHz for additional performance when needed
- 4 megabytes of L3 cache to improve data processing speed
- Supports AMD Virtualization for enhanced virtualization capabilities
- Energy-efficient 65-watt TDP for lower power consumption
- 32 nanometer lithography for optimized performance and efficiency.

Actual product image AMD Athlon X4 740 (FM2, 3.20 GHz, 4 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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