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The A4-3400 APU is a powerful dual-core processor suitable for a variety of applications. With a clock speed of up to 2.7 GHz, it delivers solid performance for everyday tasks and multimedia applications. The architecture is based on the Llano platform and utilizes a 32-nanometer lithography, allowing for efficient energy use. The processor supports AMD Virtualization, making it ideal for virtualization applications. With a maximum Thermal Design Power (TDP) of 65 watts, it is energy-efficient and well-suited for compact systems. The A4-3400 is equipped with a 512 MB L2 cache, which increases data processing speed and enhances overall performance.

- Dual-core architecture for improved multitasking capabilities
- Maximum clock speed of 2.7 GHz for high performance
- Support for AMD Virtualization for virtualization applications
- Efficient 32-nanometer lithography for lower energy consumption
- Compatible with DirectX 11 for enhanced graphics performance.

Actual product image AMD A4-3400 Apu, 2c/2t (FM1, 2.70 GHz, 2 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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AMD A4-3400 Apu, 2c/2t

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