Name: A10-6700 Apu
Brand: AMD
SKU: 440690
Rating: 5 (1 reviews)

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The A10-6700 APU is a powerful quad-core processor designed for a variety of applications. With a base clock speed of 3.7 GHz and a maximum turbo clock speed of 4.3 GHz, this processor delivers impressive performance for everyday tasks as well as more demanding applications. The integrated Radeon HD 8670D graphics provide enhanced visual representation and enable a smooth gaming experience without the need for a separate graphics card. The A10-6700 is equipped with a range of technologies, including AMD Virtualization and support for various SSE instructions, which further enhance the efficiency and performance of the processor. With a maximum thermal design power (TDP) of 65 watts, this processor is energy-efficient and well-suited for compact systems.

- Quad-core architecture for improved multitasking capabilities
- Integrated Radeon HD 8670D graphics for optimized visual performance
- Maximum turbo clock speed of 4.3 GHz for additional performance when needed
- Support for AMD Virtualization to enhance virtualization performance
- Energy-efficient 65-watt TDP for lower power consumption.

Actual product image AMD A10-6700 Apu (FM2, 3.70 GHz, 4 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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